Silicon Package
Silicon Packaging Technology is the very latest in packaging innovation. Taking advantage of the beneficial properties of silicon and our proprietary technical know-how, SiBDI has developed state of the art LED packages. The silicon products are engineered and tested to deliver high efficiency and high reliability, which provide the best solution for solid state lighting applications.
The many advantages of a silicon substrate include lower thermal resistance, high reliability, and small footprint ideal for SMT manufacturing and compact applications
|
Package Substrate |
Thermal conductivity |
Rth |
CTE |
Metal Line |
|
Silicon |
150W/m·K |
6°C/W |
4ppm/K |
<10um |
Silicon’s flat surface and strong lens adhesion, with an average lens shear force of 3.4kg, makes optic designing simple and reliable. In addition to the advantageous material properties of silicon, our precise process control achieved with wafer scale processing provides high quality products and low cost, achieving the best lm/$ value on the market.